Call for Papers

Important Dates

Full Paper Submission: January 31^st, 2020
Notification of Acceptance: March 2^nd, 2020

A PDF version of this SPI 2020 call for papers can be downloaded here.

The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity. Detailed instructions for manuscript submission are available here. All contributions will be subjected to a rigorous review process, conducted by the TPC. Accepted papers will be included in the conference program as oral or poster presentations, depending on the results of the review process. The conference proceedings and will be submitted to the IEEE Xplore® digital library.

Topics of Interest

Modeling and simulation for SI/PI
Coupled signal and power Integrity analysis
Noise reduction and equalization techniques
High-speed link design and modeling
Power distribution networks
RF/microwave/mm-wave systems and packaging solutions
Antennas-in-package and antennas-on-chip
3D IC and packages (TSV/SiP/SoC)
Nano-interconnects and nano-structures
Electromagnetic theory and modeling
Transmission line theory and modeling
Macromodeling, reduced order models
Electromagnetic compatibility
Design methodology/flow measurements
Jitter and noise modeling
Stochastic/sensitivity analysis
Electro-thermal modeling
Chip-package co-design
Novel CAD concepts
Optical interconnects
AI in electronics design

Best Student Paper Award

In order to recognize excellence in research, a Best Student Paper Award will be assigned by the TPC based on the following criteria:

Novelty
Advancement of the theory and application
Quality of the presented results
Quality of the written manuscript
Practicality and industrial relevance of the presented work
Practicality and industrial relevance of the presented work

Each accepted paper authored by a student is eligible for the SPI Best Student Paper Award, provided that the student is the first and primary author, and the presenter at the conference.