Important Dates
Full Paper Submission: January 31st, 2020
Notification of Acceptance: March 2nd, 2020
Call for Papers
A PDF version of this SPI 2020 call for papers can be downloaded here.
The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity. Detailed instructions for manuscript submission are available here. All contributions will be subjected to a rigorous review process, conducted by the TPC. Accepted papers will be included in the conference program as oral or poster presentations, depending on the results of the review process. The conference proceedings and will be submitted to the IEEE Xplore® digital library.
Topics of Interest
- Modeling and simulation for SI/PI
- Coupled signal and power Integrity analysis
- Noise reduction and equalization techniques
- High-speed link design and modeling
- Power distribution networks
- RF/microwave/mm-wave systems and packaging solutions
- Antennas-in-package and antennas-on-chip
- 3D IC and packages (TSV/SiP/SoC)
- Nano-interconnects and nano-structures
- Electromagnetic theory and modeling
- Transmission line theory and modeling
- Macromodeling, reduced order models
- Electromagnetic compatibility
- Design methodology/flow measurements
- Jitter and noise modeling
- Stochastic/sensitivity analysis
- Electro-thermal modeling
- Chip-package co-design
- Novel CAD concepts
- Optical interconnects
- AI in electronics design
Best Student Paper Award
In order to recognize excellence in research, a Best Student Paper Award will be assigned by the TPC based on the following criteria:
- Novelty
- Advancement of the theory and application
- Quality of the presented results
- Quality of the written manuscript
- Practicality and industrial relevance of the presented work
- Practicality and industrial relevance of the presented work
Each accepted paper authored by a student is eligible for the SPI Best Student Paper Award, provided that the student is the first and primary author, and the presenter at the conference.